Titanium Sputtering Targets: Planar vs Bonded Targets
A monolithic target is a single titanium component; a bonded target combines titanium with an approved backing plate. The correct choice follows the cathode design, cooling, power density and target thickness.
Construction Comparison
| Item | Monolithic target | Bonded target |
|---|---|---|
| Construction | Single titanium target | Titanium bonded to copper or approved backing |
| Interface | Target directly matches cathode fixture | Bond and backing transfer heat and support assembly |
| Inspection | Purity, dimensions, flatness and surface | All monolithic checks plus backing and bond coverage/voids |
Purity and Process Data
State minimum titanium purity and maximum limits for critical metallic and interstitial impurities. Structural grade terminology alone may omit deposition-critical composition requirements. Include density, grain or magnetic requirements only when the process needs them.
Bonding Definition
For bonded targets, define backing material and drawing, bond method, coverage, maximum void size and distribution, service temperature, cooling interface and inspection method.
Match the Exact Cathode
See Titanium Sputtering Targets and send the target/cathode drawing, purity limits and bonding requirements.
FAQ
Is higher purity always required?
Purity should match film performance and process control; unnecessary limits can increase cost without improving the application.
Can the backing plate be reused?
Reuse depends on backing condition, dimensions, cooling interfaces, approved de-bonding and cleaning procedure.
Related Reading
How to Specify Titanium Fluid Manifolds · Titanium Sputtering Targets: Planar vs Bonded